THERMAL MANAGEMENT IN HIGH-PERFORMANCE ELECTRONICS: INNOVATIVE HEAT DISSIPATION SOLUTIONS FOR COOLING SYSTEMS. Journal of Engineering Education and Practice, [S. l.], v. 1, n. 02, p. 37–46, 2023. Disponível em: https://journaleep.com/index.php/JEEP/article/view/11. Acesso em: 30 may. 2026.